IEEE SCEMS 2024

 

2024 IEEE 7th Student Conference on Electric Machines and Systems

IEEE SCEMS 2024

 

2024 IEEE 7th Student Conference on Electric Machines and Systems

IEEE SCEMS 2024

 

2024 IEEE 7th Student Conference on Electric Machines and Systems

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Dear Colleagues,    

    We are very pleased to welcome you to the 2024 IEEE 7th Student Conference on Electric Machines and Systems (IEEE SCEMS 2024) which is organized by University of Macau IEEE Student Branch Industry Applications Society Chapter and will be held in Macau, China on November 6-8, 2024, both onsite and online.

   IEEE SCEMS is a student conference that offers a platform for researchers, scientists, and engineers to present their research results, exchange academic ideas, and expand their networks. The forums cover a range of topics, including the latest research and development in power systems, electrical machines, power electronics, and multi-energy systems. Whether one is interested in academic research or wishes to communicate with peers, they will find their own opportunities and value in IEEE SCEMS. It is hoped that every attendee will gain appropriate knowledge and experience in this conference.

    Macau, located in southern China, is a Special Administrative Region of China. Macau is known for its magnificent scenery, especially its stunning beaches and the spectacular Macau Tower. The city is also home to many historically famous attractions such as St. Paul's and Guanye Street. Whether you want to experience the prosperity and vitality of the city or the interplay of Chinese and Western cultures, Macau has it all.

    We look forward to meeting you in Macau!

Zhenwei ZHANG

IEEE SCEMS 2024 General Chair

 

|| Welcome to SCEMS2024

Call For Paper: May 10, 2024

Full Paper Submission: Aug 1, 2024

Acceptance Notification: Aug 31, 2024

Final Paper Submission: Sep 30 - Oct 30, 2024

Conference: Nov 6 - 8, 2024

 

·The conference will be published in IEEE Xplore, and index by EI, Scopus.

·Selected paper will be further reviewed for publication on IEEE Transactions on Industry Application.